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This is a device for surface inspection of wafers after polishing.
- Detects foreign particles of φ0.2μm or larger using a scattered light detection method. - Uses vacuum suction on the backside, ensuring no contact with the wafer surface.
This is a device for visual inspection and thickness measurement of 8-inch silicon wafers.
- Visual inspection can be easily performed using JOG stick operation. - Alignment is performed based on the notch position, and clamping measurement is conducted using a capacitive sensor.
It is a semi-automatic device for visual inspection of 8-inch silicon wafers.
The cassette containing the wafers will be automatically transported to the inspection stage. Based on the pass/fail judgment results from the operator, the cassette for inserting the wafers will be selected and transported.
Inspection of the connection status of the FPC cable, etc.
This device uses an image processing system to inspect the connection status of the FPC cable connected to the specified substrate. It eliminates discrepancies in judgment by operators, ensuring stable quality. Additionally, it is possible to prevent the outflow of defective products.
Pass/Fail Judgment Device
It is a device that detects scratches on the front and back surfaces of silicon wafers through image processing and determines pass or fail.
Work length measurement and foreign object inspection
Using an image processing system, we will perform length measurement and foreign object inspection of the workpiece. The workpieces will be sorted based on the pass/fail judgment results from the image processing system.
This machine is a device that performs macro and micro inspections of φ8-inch wafers in the semiconductor manufacturing process.
In macro inspection, the wafer angle can be freely adjusted using joystick operation. Additionally, in micro inspection through microscope observation, it is possible to switch between viewing through the eyepiece and the monitor. Two wafer cassettes can be mounted.
